Semiconductor Manufacturing Process,
Semiconductor
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Semiconductor specifications highlight
Positioning system specifications for semiconductor applications are dictated
primarily by the line width on the wafer. Trends of feature sizes are shown
in the following Wikipedia list. As the feature width decreases, the
required performance of the positioning system increases respectively.
130 nm (.13 µm)
— 2000
90 nm — 2002
65 nm — 2006
45 nm — 2008
32 nm — 2010
22 nm — 2011
16 nm — approx. 2013
11 nm — approx. 2015
The most challenging specifications of positioning systems in semiconductor
applications are as follows:
1. High Precision variables in 6 Degrees of freedom,
both deterministic ( accuracy ) and statistic ( repeatability ), including
- linear motion - axial position, straightness, flatness, pitch, yaw roll
- rotary motion - angular position, axial run out, radial run out, wobble,
flatness
2. High Dynamic accuracy in 6 degrees of freedom,
including:
- following error
- constant velocity
- position holding stability
3. High throughput, including:
- High acceleration
- High velocity
- Low settling time
4. Harsh Environment including:
- clean room
- vacuum
- temperature
- radiation
- vibrations
5. High reliability and low maintainability due to
high cost of FAB, on the order of $B's, with respective high cost for downtime,
including: